Destructive Physical Analysis (DPA) of Electronic Components

Our Services Failure Analysis Destructive Physical Analysis (DPA) of Electronic Components

Destructive Physical Analysis (DPA) of Electronic Components

GRG Test customizes integrated DPA test service and test scheme design based on the characteristics of customer terminals to help prevent the installation or use of components with obvious or potential defects.

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Service Introduction

Any factor such as the design, structure, material and process of components may lead to differences in manufacturing quality, which may make the components unable to meet the intended use or the requirements of relevant specifications; On the other hand, if related problems appear after installation, then the rectification and manufacturing costs will be raised. Therefore, it is particularly important to avoid the use of components with obvious or potential defects as soon as possible, and to put forward treatment opinions and improvement measures on the batch to promote the reliability of electronic components and ultimately enhance the quality of electronic equipment.

Test Cycle:

5 to 10 working days, urgent services are available

Product Scope:

Cover all types and packages of electronic component models, including: resistor; capacitor; magnetic bead; inductor; transformer; crystal oscillator; crystal resonator; relay; semiconductor discrete devices (diode, triode, FET, Darlington array, semiconductor optoelectronic device, etc.); electric connector; switch and panel elements; semiconductor integrated circuit (time base circuit, bus transceiver, buffer, driver, level translator, gate device, trigger, LVDS line transceiver, operational amplifier, voltage regulator, voltage comparator, power chip (voltage regulator, switching power converter, power monitor, power management, etc.), digital to analog converter (A/D, D/A, SRD), memory, programmable logic device, single chip microcomputer, microprocessor, controller, etc.); filter; power module; IGBT, etc.

Test Items:

Test Items	Test Method and Standard	Sample Requirements
Visual Inspection	GJB4027 or customer requirements	Sample in accordance with specification requirements

X-ray Inspection	GJB4027 or customer requirements	Sample in accordance with specification requirements

PIND	GJB4027 or customer requirements	Sample in accordance with specification requirements

Physical Check	GJB4027 or customer requirements	Sample in accordance with specification requirements

Airproof Check	GJB4027 or customer requirements	Sample in accordance with specification requirements

Internal Vapor Analysis	GJB4027 or customer requirements	Sample in accordance with specification requirements

Decap	GJB4027 or customer requirements	Sample in accordance with specification requirements

Internal Inspection	GJB4027 or customer requirements	Sample in accordance with specification requirements

SEM/EDAX	GJB4027 or customer requirements	Sample in accordance with specification requirements

C－SAM	GJB4027 or customer requirements	Sample in accordance with specification requirements

Terminal strength	GJB4027 or customer requirements	Sample in accordance with specification requirements

Pull Test	GJB4027 or customer requirements	Sample in accordance with specification requirements

Cross-section	GJB4027 or customer requirements	Sample in accordance with specification requirements

Attachment’s strength	GJB4027 or customer requirements	Sample in accordance with specification requirements

Integrality Inspection for Glass Passivation	GJB4027 or customer requirements	Sample in accordance with specification requirements

Sampling with Microscope	GJB4027 or customer requirements	Sample in accordance with specification requirements

bonding strength	GJB4027 or customer requirements	Sample in accordance with specification requirements

Contact Check	GJB4027 or customer requirements	Sample in accordance with specification requirements

Shear Test	GJB4027 or customer requirements	Sample in accordance with specification requirements