Microsection serves as the most commonly used internal quality evaluation method in the electronic industry. GRG Test has complete slice analysis and test equipment as well as experienced slice analysis talents who can provide slice services efficiently and accurately.
Due to the substandard welding process of the product or its solder joints during the production, assembly and use, a number of problems such as cracking, welding cracks and device delamination would appear under the action of various stresses, which would directly affect the normal use of the product in serious cases.
Test Cycle:
3 to7 working days, emergency services are available